Integrated circuits and manufacturing methods thereof

ABSTRACT

An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is separated from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. A first metallic structure is electrically coupled with the first source region. A second metallic structure is electrically coupled with the second drain region. A third metallic structure is disposed over and electrically coupled with the first and second metallic structures. A width of the first metallic structure is substantially equal to or larger than a width of the third metallic structure.

CROSS-REFERENCES TO RELATED APPLICATIONS

The present application is a Continuation of U.S. patent application Ser. No. 16/723,939, filed Dec. 20, 2019, issuing as U.S. Pat. No. 11,581,314, which is a Divisional of U.S. patent application Ser. No. 15/094,697, filed Apr. 8, 2016, now U.S. Pat. No. 10,535,655, which is a Continuation of U.S. patent application Ser. No. 13/086,186, entitled “INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREROF,” filed Apr. 13, 2011, now U.S. Pat. No. 9,312,260 which is a Continuation-in-part of U.S. patent application Ser. No. 12/787,966, entitled “INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF,” filed May 26, 2010, now U.S. Pat. No. 8,362,573, which is related to U.S. patent application Ser. No. 13/722,142, filed Dec. 20, 2012, now U.S. Pat. No. 9,385,213, which is a Divisional of U.S. patent application Ser. No. 12/787,966, filed May 26, 2010, now U.S. Pat. No. 8,362,573, each of which is hereby incorporated by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates generally to the field of semiconductor devices, and more particularly, to integrated circuits and method of forming the integrated circuits.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapid growth. Technological advances in IC materials and design have produced generations of ICs where each generation has smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing ICs and, for these advances to be realized, similar developments in IC processing and manufacturing are needed.

In the course of IC evolution, functional density (i.e., the number of interconnected devices per chip area) has generally increased while geometry size (i.e., the smallest component (or line) that can be created using a fabrication process) has decreased. This scaling down process generally provides benefits by increasing production efficiency and lowering associated costs. Such scaling-down also produces a relatively high power dissipation value, which may be addressed by using low power dissipation devices such as complementary metal-oxide-semiconductor (CMOS) devices.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale and are used for illustration purposes only. In fact, the numbers and dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1A is a schematic drawing illustrating exemplary layout layers of an exemplary integrated circuit.

FIG. 1B is a cross-sectional view of an exemplary integrated circuit taken along a section line 1B-1B shown in FIG. 1A.

FIG. 2A is a schematic drawing illustrating exemplary layout layers of another exemplary integrated circuit.

FIG. 2B is a cross-sectional view of an exemplary integrated circuit taken along a section line 2B-2B shown in FIG. 2A.

FIG. 3 is a flowchart illustrating an exemplary method of forming an integrated circuit.

FIGS. 4A-4E are schematic cross-sectional views illustrating another exemplary method of forming an integrated circuit taken along a section line 2B-2B shown in FIG. 2A.

FIG. 5 is a schematic drawing illustrating a system including an exemplary integrated circuit disposed over a substrate board.

FIG. 6A is a schematic drawing illustrating exemplary layout layers of an exemplary integrated circuit as a top view; FIG. 6B is a cross-sectional view of an exemplary integrated circuit taken along a section line 6B-6B shown in FIG. 6A.

DETAILED DESCRIPTION

For CMOS devices, contact plugs are generally used for electrical connections between source/drain (S/D) regions and metal layers M1 of transistors. Generally, the contact plugs are disposed in contact holes that are formed in an inter-level dielectric (ILD) layer. The contact holes marked on a mask layer are square. The square patterns on the mask layer are transferred on the ILD layer and become rounded. The contact plugs thus have a substantially round shape from a top view that is orthogonal to a surface of a wafer on which the transistors are formed. It is found that if the geometry of the CMOS devices scales down, the S/D resistances of the transistors increase. The increased S/D resistances compromise electrical performances, e.g., operation current, speed, frequency, etc, of the transistors or circuits.

It is understood that the following descriptions provides many different embodiments, or examples, for implementing different features of the disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Moreover, the formation of a feature on, connected to, and/or coupled to another feature in the present disclosure that follows may include embodiments in which the features are formed in direct contact, and may also include embodiments in which additional features may be formed interposing the features, such that the features may not be in direct contact. In addition, spatially relative terms, for example, “lower,” “upper,” “horizontal,” “vertical,” “above,” “below,” “up,” “down,” “top,” “bottom,” etc. as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) are used for ease of the present disclosure of one features relationship to another feature. The spatially relative terms are intended to cover different orientations of the device including the features.

FIG. 1A is a schematic drawing illustrating exemplary layout layers of an exemplary integrated circuit. The exemplary drawing shown in FIG. 1A merely depicts overlaps of a diffusion layer, a gate electrode layer, and a metallic structure. In FIG. 1A, an integrated circuit 100 can include a P-type transistor 101 that is electrically coupled with an N-type transistor 105. In some embodiments, the integrated circuit 100 can be a digital circuit, an analog circuit, a mixed-signal circuit, a static random access memory (SRAM) circuit, an embedded SRAM circuit, dynamic random access memory (DRAM) circuit, an embedded DRAM circuit, a non-volatile memory circuit, e.g., FLASH, EPROM, E²PROME, a field-programmable gate circuit, or any combinations thereof In some embodiments, the P-type transistor 101 and the N-type transistor 105 can be deployed in an inverter, a logic gate circuit, an amplifier, a charge pump circuit, or any circuit that have a CMOS device.

Referring to FIG. 1A, the integrated circuit 100 can include diffusion areas 110 and 120. The diffusion area 110 can include a source region 111 and a drain region 113 of the P-type transistor 101. The diffusion area 120 can include a source region 121 and a drain region 123 of the N-type transistor 105. The diffusion area 110 can be spaced from the diffusion area 120 by an isolation structure 115. The isolation structure 115 can include a shallow trench isolation (STI) structure and/or a local oxidation of silicon (LOCOS) structure. In some embodiments, widths W₁ and W₂ of the diffusion areas 110 and 120, respectively, are different. In other embodiments, the width Wi of the diffusion area 110 is larger than the width W₂ of the diffusion area 120.

Referring to FIG. 1A, a gate electrode 130 can continuously extend across the diffusion areas 110 and 120 in a routing direction of the gate electrode 130. In some embodiments, the gate electrode 130 can include gate electrode portions 130 a and 130 b for the P-type transistor 101 and the N-type transistor 105, respectively. The gate electrode portions 130 a and 130 b can be configured to receive voltages, controlling on or off of the P-type transistor 101 and the N-type transistor 105, respectively. It is noted that the routing direction shown in FIG. 1A is merely exemplary. In other embodiments, the routing direction can be in the horizontal direction or any direction that tilts with respect to the horizontal direction.

Referring again to FIG. 1A, a metallic structure 140 can be electrically coupled with the source region 111 of the P-type transistor 101. The metallic structure 140 and the diffusion area 110 can overlap with a distance D₁ in the routing direction. A metallic structure 150 can be electrically coupled with the drain regions 113 and 123 of the P-type transistor 101 and the N-type transistor 105, respectively. The metallic structure 150 and the diffusion area 110 can overlap with a distance D₂ in the routing direction. The distance D₁ is larger than the distance D₂. In some embodiments, the metallic structure 140 directly contacts the source region 111. The metallic structure 150 directly contacts the drain regions 113 and 123.

Referring to FIG. 1A, a metallic structure 160 can be electrically coupled with the source region 121 of the N-type transistor 101. The metallic structure 160 and the diffusion area 120 can overlap with a distance D₃ in the routing direction. The metallic structure 150 and the diffusion area 120 can overlap with a distance D₄ in the routing direction. In some embodiments, the distance D₃ is larger than the distance D₄. In other embodiments, the distance D₃ is larger than the distance D₂. In some embodiments, the metallic structure 160 directly contacts the source region 121.

It is noted that the structure shown in FIG. 1A is merely exemplary. In some embodiments, a sum of distances D₁ and D₂ can be substantially equal to the width W₁. In other embodiments, a sum of distances D₁ and D₂ can be larger or smaller than the width W₁. In still other embodiments, a sum of distances D₃ and D₄ can be substantially equal to the width W₂. In yet still other embodiments, a sum of distances D₃ and D₄ can be larger or smaller than the width W₂.

It is also noted that the term “a metallic structure” here can mean a metallic line, a metallic wire, a metallic rope, a metallic string, a metallic code, a metallic slat, or any metallic structure that continuously extends for a predetermined distance. In some embodiments, the metallic structures 140, 150, and 160 can be referred to as a metal zero (M0) layer.

In some embodiments, a ratio of the distance D₁ to the width W₁ is between about 0.75:1 and 1:1, and a ratio of the distance D₂ to the width W₁ is between about 0.1:1 and 0.33:1. In other embodiments, a ratio of the distance D₃ to the width W₂ is betweenabout 0.75:1 and 1:1, and a ratio of the distance D₄ to the width W₂ is between about 0.1:1 and 0.33:1.

It is noted that the metallic structures 140, 150, and 160 can each at least partially continuously extend over the diffusion areas 110 and/or 120 for electrically coupling the respective source and drain regions. With the at least partially continuously extending structures, the source/drain (S/D) resistances of the transistors can be reduced.

It is also noted that the distances D₂ and D₄ each do not continuously extend from an edge 110 a to an opposite edge 110 b of the diffusion area 110 and an edge 120 a to an opposite edge 120 b of the diffusion area 120, respectively. The metallic structure 150 does not fully cover the diffusion areas 110 and 120 in the routing direction. With the structures, parasitic capacitances between the gate electrode portion 130 to each of the metallic structures 140, 150, and 160, and/or parasitic capacitances among the metallic structures 140, 150, and 160 can be reduced. By modifying the resistances and/or the parasitic capacitances, the electrical characteristics, e.g., operation speed, operation frequency, etc, of the integrated circuit 100 can be desirably achieved.

Table 1 illustrates speed simulations for at least one inverter with various fingers. As shown in Table 1, the structures with D₁/W₁, D₂/W₁, D₃/W₂, and D₄/W₂ being 1/1 are used as bases. The base structures each have metallic structures 140, 150, and 160 fully covering the diffusion areas 110 or 120 in the routing direction. The simulation speed of the base structures are presumed as 1.

TABLE 1 Ratios of D₁/W₁ Ratios of D₁/W₁ Ratios of D₁/W₁ and D₃/W₂ are and D₃/W₂ are and D₃/W₂ are 1/1 and ratios 1/1 and ratios 0.75/1 and ratios of D₂/W₁ and of D₂/W₁ and of D₂/W₁ and D₄/W₂ are 1/1 D₄/W₂ are 0.33/1 D₄/W₂ are 0.33/1 1 finger 1 1.096 1.104 4 fingers 1 1.088 1.089 24 fingers 1 1.084 1.081

Compared with the base structures, exemplary structures with D₁/W₁, D₃/W₂ being 1/1 and D₂/W₁, D₄/W₂ being 0.33/1 can provide a speed gain by 9.6%, 8.8%, and 8.4% for 1-finger, 4-fingers, and 24-fingers structures, respectively, as shown in the middle column. Another exemplary structures with D₁/W₃, D₃/W₂ being 0.75/1 and D₂/W₁, D₄/W₂being 0.33/1 can provide a speed gain by 10.4%, 8.9%, and 8.1% for 1-finger, 4-fingers, and 24-fingers structures, respectively, as shown in the right column. It is found that the modification and/or changes of D₁/W₁, D₂/W₁, D₃/W₂, and/or D₄/W₂ can achieve unexpected speed gains of inverters.

FIG. 1B is a cross-sectional view of an exemplary integrated circuit taken along a section line 1B-1B shown in FIG. 1A. As noted, FIG. 1A merely illustrates several layout layers of the integrated circuit 100. The cross-sectional view shown in FIG. 1B can depict more features of the integrated circuit 100.

Referring to FIG. 1B, the P-type transistor 101 and the N-type transistor 105 can be formed on a substrate 103. As noted, the P-type transistor 101 and the N-type transistor 105 can be separated by the isolation structure 115. In some embodiments, the substrate 103 may include an elementary semiconductor material, a compound semiconductor material, an alloy semiconductor material, or any other suitable material or combinations thereof. The elementary semiconductor material can include silicon or germanium in crystal, polycrystalline, or an amorphous structure. The compound semiconductor material can include silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, indium arsenide, and indium antimonide. The alloy semiconductor material can include SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and GaInAsP. In one embodiment, the alloy semiconductor substrate may have a gradient SiGe feature in which the Si and Ge composition change from one ratio at one location to another ratio at another location. In another embodiment, the alloy SiGe is formed over a silicon substrate. In another embodiment, a SiGe substrate is strained. Furthermore, the semiconductor substrate may be a semiconductor on insulator, such as a silicon on insulator (SOI), or a thin film transistor (TFT). In some examples, the semiconductor substrate may include a doped epitaxial layer or a buried layer. In other examples, the compound semiconductor substrate may have a multilayer structure, or the substrate may include a multilayer compound semiconductor structure.

In some embodiments, an N-type well region 107 and/or a P-type well region 109 can be optionally formed in the substrate 103 for the P-type transistor 101 and the N-type transistor 105, respectively. The N-type well region 107 can have dopants such as Arsenic (As), Phosphorus (P), other group V elements, or any combinations thereof. The P-type well region 109 can have dopants such as Boron (B) and/or other group III elements.

Referring to FIG. 2B, the P-type transistor 101 can include the source region 111 and the drain region 113. In some embodiments, the source region 111 and the drain region 113 can include structures 111 c or 113 c, respectively, that can provide a stress to a channel (not labeled) of the P-type transistor 101. The stressed channel can modify a mobility of carriers therein so as to change electrical characteristics, e.g., electrical current, of the P-type transistor 101. In some embodiments, the structures 111 c and 113 c in the source region 111 and the drain region 113 can be referred to as a raised source and a raised drain, respectively. In other embodiments, the structures 111 c and 113 c each can include a single SiGe or Si_(x)Ge_(1-x) layer, a multi-layer SiGe or Si_(x)Ge_(1-x) structure, an epitaxial structure, a compound material structure, other materials that can modify the carrier mobility of the P-type transistor 101, or any combinations thereof.

In some embodiments, the source region 111 and the drain region 113 can optionally include P-type lightly-doped drains (LDDs) 111 a and 113 a, respectively. The P-type LDDs 111 a and 113 a can each have a dopant type that is opposite to that of the N-type well region 107. In other embodiments, the source region 111 and the drain region 113 can include silicide regions 111 b and 113 b, respectively. The silicide regions 111 b and 113 b may comprise at least one material such as nickel silicide (NiSi), nickel-platinum silicide (NiPtSi), nickel-platinum-germanium silicide (NiPtGeSi), nickel-germanium silicide (NiGeSi), ytterbium silicide (YbSi), platinum silicide (PtSi), iridium silicide (IrSi), erbium silicide (ErSi), cobalt silicide (CoSi), other suitable materials, or any combinations thereof.

Referring again to FIG. 2B, the gate electrode portion 130 a can include an interfacial dielectric layer 117 a. The interfacial dielectric layer 117 a can be disposed over the substrate 103. The interfacial dielectric layer 117 a may include a material such as silicon oxide, silicon nitride, silicon oxynitride, other gate dielectric materials, or any combinations thereof.

In some embodiments, the gate electrode portion 130 a can include a multi-layer structure 131 that can include at least one high dielectric constant (high-k) layer and at least one metal work function layer. The at least one high-k dielectric layer can be formed over the interfacial layer 117 a. The high-k dielectric layer can include high-k dielectric materials such as HfO₂, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, other suitable high-k dielectric materials, or any combinations thereof. In some embodiments, the high-k material may further be selected from metal oxides, metal nitrides, metal silicates, transition metal-oxides, transition metal-nitrides, transition metal-silicates, oxynitrides of metals, metal aluminates, zirconium silicate, zirconium aluminate, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, titanium oxide, aluminum oxide, hafnium dioxide-alumina alloy, other suitable materials, or any combinations thereof.

In some embodiments, the at least one metal work function layer of the multi-layer structure 131 can include at least one P-metal work function layer and at least one N-metal work function layer. In other embodiments, the at least one metal work function layer of the gate electrode portion 130 a can solely include at least one P-metal work function layer without any N-metal work function layer. In some embodiments, P-type work function materials can include compositions such as ruthenium, palladium, platinum, cobalt, nickel, and conductive metal oxides, and/or other suitable materials. N-type metal materials can include compositions such as hafnium, zirconium, titanium, tantalum, aluminum, metal carbides (e.g., hafnium carbide, zirconium carbide, titanium carbide, aluminum carbide), aluminides, and/or other suitable materials.

In some embodiments, the multi-layer structure 131 can include at least one diffusion barrier. The at least one diffusion barrier can be disposed between the gate dielectric material and the work function metal material. The diffusion barrier can be configured to prevent metallic ions of the work function metal material from diffusing into the gate dielectric material. The diffusion barrier may comprise at least one material such as aluminum oxide, aluminum, aluminum nitride, titanium, titanium nitride (TiN), tantalum, tantalum nitride, other suitable material, and/or combinations thereof.

Referring to FIG. 1B, the gate electrode portion 130 a can include a conductive layer 135 a. The conductive layer 135 a can be surrounded by the multi-layer structure 131. The conductive layer 135 a can be made of at least one material, such as aluminum, copper, Ti, TiN, TaN, Ta, TaC, TaSiN, W, WN, MoN, MoON, RuO₂, and/or other suitable materials.

Referring again to FIG. 1B, the N-type transistor 105 can include the source region 121 and the drain region 123. In some embodiments, the source region 121 and the drain region 123 can optionally include N-type lightly-doped drains (LDDs) 121 a and 123 a, respectively. The N-type LDDs 121 a and 123 a can have a dopant type that is opposite to that of the P-type well region 109. In other embodiments, the source region 121 and the drain region 123 can include silicide regions 121 b and 123 b, respectively. The silicide regions 121 b and 123 b can have a metallic material that is same as or similar to that of the silicide regions 111 b and 113 b.

In other embodiments, the source region 121 and the drain region 123 can each include a stress structure (not shown). The stress structures can modify the carrier mobility in the channel of the N-type transistor 105. In some embodiments, the stress structures can each include a single SiC or Si_(x)C_(1-x), layer, a multi-layer SiC or Si_(x)C_(1-x) structure, an epitaxial structure, a compound material structure, other materials that can modify the carrier mobility of the N-type transistor 105, or any combinations thereof.

Referring again to FIG. 2B, the gate electrode portion 130 b can include an interfacial dielectric layer 117 b. The interfacial dielectric layer 117 b can be disposed over the substrate 103. The interfacial dielectric layer 117 b may include a material such as silicon oxide, silicon nitride, silicon oxynitride, other gate dielectric materials, and/or combinations thereof.

In some embodiments, the gate electrode portion 130 b can include a multi-layer structure 133 that can include at least one high dielectric constant (high-k) layer and at least one metal work function layer. The at least one high-k dielectric layer can be formed over the interfacial layer 117 b. In some embodiments, the at least one high-k dielectric layer of the multi-layer structure 133 can be as same as or similar to that of the multi-layer structure 131.

In some embodiments, the at least one metal work function layer of the gate electrode portion 130 b can solely include at least one N-type metal work function layer without any P- type metal work function layer. In some embodiments, N-type metal materials can include compositions such as hafnium, zirconium, titanium, tantalum, aluminum, metal carbides (e.g., hafnium carbide, zirconium carbide, titanium carbide, aluminum carbide), aluminides, and/or other suitable materials.

In some embodiments, the multi-layer structure 133 can include at least one diffusion barrier. The at least one diffusion barrier can be disposed between the gate dielectric material and the work function metal material. The diffusion barrier can be configured to prevent metallic ions of the work function metal material from diffusing into the gate dielectric material. The diffusion barrier may comprise at least one material such as aluminum oxide, aluminum, aluminum nitride, titanium, titanium nitride (TiN), tantalum, tantalum nitride, other suitable material, and/or combinations thereof

Referring to FIG. 1B, the gate electrode portion 130 b can include a conductive layer 135 b. The conductive layer 135 b can be surrounded by the multi-layer structure 133. The conductive layer 135 b can be made of at least one material that is the same as or similar to that of the conductive layer 135 a.

Referring to FIG. 1B, spacers 141 a and 141 b can be optionally disposed on sidewalls of the gate electrode portions 130 a and 130 b, respectively. The spacers 141 a and 141 b can be made of at least one material, such as silicon oxide, silicon nitride, silicon oxynitride, other dielectric materials, or any combinations thereof.

Referring to FIG. 1B, at least one dielectric layer 151 can be disposed over the substrate 103 and around the spacers 141 a and 141 b. The at least one dielectric layer 151 can include at least one material such as phosphorous-doped silicate glass (PSG), boron-doped silicate glass (BSG), boron-phosphorous-doped silicate glass (BPSG), undoped silicate glass (USG), silicon oxide, silicon oxide, silicon nitride, silicon oxynitride, low-k dielectric material, other dielectric materials, or combinations thereof.

In some embodiments, at least one etch stop layer (ESL) 153 can be disposed over the at least one dielectric layer 151. The at least one ESL 153 can include at least one material such as silicon nitride, silicon oxynitride, silicon carbide, silicon oxycarbide, other dielectric materials, or any combinations thereof.

Referring to FIG. 1B, at least one dielectric layer 153 can be disposed over the at least one ESL 153. The at least one dielectric layer 153 can include at least one material such as silicon oxide, e.g., plasma-enhanced oxide (PEOX), undoped silicate glass (USG), phosphorous-doped silicate glass (PSG), boron-doped silicate glass (BSG), boron-phosphorous-doped silicate glass (BPSG), silicon oxide, silicon oxide, silicon nitride, silicon oxynitride, low-k dielectric material, other dielectric materials, or combinations thereof.

In FIG. 1B, the metallic structures 140, 150, and 160 can be disposed through the dielectric layers 151, 155, and the ESL 153. In some embodiments, the metallic structures 140, 150, and 160 can each include at least one barrier layer (not shown) at their bottom regions. The barrier layer may comprise at least one material such as aluminum oxide, aluminum, aluminum nitride, titanium, titanium nitride (TiN), tantalum, tantalum nitride, other suitable material, and/or combinations thereof In other embodiments, the metallic structures 140, 150, and 160 can each be made of at least one material, such as aluminum, copper, Ti, TiN, TaN, Ta, TaC, TaSiN, W, WN, MoN, MoON, RuO₂, and/or other suitable materials.

In some embodiments, the metallic structures 140 and 160 can directly contact the source regions 111 and 121, respectively. The metallic structure 150 can directly contact the drain regions 113 and 123. In other embodiments, the metallic structures 140 and 160 can directly contact the silicide regions 111 b and 121 b, respectively. The metallic structure 150 can directly contact the silicide regions 113 b and 123 b.

In some embodiments, other dielectric materials, via plugs, metallic regions, and/or metallic lines (not shown) can be formed over the gate electrode portions 130 a and 130 b for interconnection. The dielectric layers may include materials such as silicon oxide, silicon nitride, silicon oxynitride, low-k dielectric material, ultra low-k dielectric material, or any combinations thereof. The via plugs, metallic regions, and/or metallic lines can include materials such as tungsten, aluminum, copper, titanium, tantalum, titanium nitride, tantalum nitride, nickel silicide, cobalt silicide, other proper conductive materials, and/or combinations thereof. The via plugs, metallic regions, and/or metallic lines can be formed by any suitable processes, such as deposition, photolithography, and etching processes, and/or combinations thereof.

FIG. 2A is a schematic drawing illustrating exemplary layout layers of another exemplary integrated circuit. Items of FIG. 2A that are the same items in FIG. 1A are indicated by the same reference numerals, increased by 100. In FIG. 2A, an integrated circuit 200 can include a plurality of metallic structure, e.g., metallic structures 270 a-270 d, each directly contacting one of source regions 211, 221 and drain regions 213, 223. In some embodiments, the metallic structures 270 a-270 d can at least partially overlap respective metallic structures 240, 250, and 260 in the routing direction.

In some embodiments, the width of each of the metallic structures 270 a-270 d can be substantially equal the respective metallic structures 240, 250, and 260. In other embodiments, the metallic structures 270 a-270 d can be wider or narrower than the respective metallic structures 240, 250, and 260. In some embodiments, the metallic structures 270 a-270 d can be referred to as an M01 metal structure and the metallic structures 240, 250, and 260 can be referred to as M02 metal structures.

In some embodiments, the metallic structures 270 a-270 d can each continuously extend from an edge 210 a to an opposite edge 210 b of the diffusion area 210 or an edge 220 a to an opposite edge 220 b of the diffusion area 220. In other embodiments, the metallic structures 270 a-270 b can each extend over or shorten from the edges 210 a-210 b by a distance that is about 5% of a width W_(1′) of the diffusion area 210 or less. In still other embodiments, the metallic structures 270 c-270 d can each extend over or shorten from the edges 220 a-220 b by a distance that is about 5% of a width W_(2′) of the diffusion area 220 or less.

In some embodiments, the metallic structure 240 and the diffusion area 210 can overlap with a distance D_(1′) in the routing direction. The metallic structure 250 and the diffusion area 210 can overlap with a distance D_(2′) in the routing direction. The distance D_(1′) is larger than the distance D_(2′). The metallic structure 260 and the diffusion area 220 can overlap with a distance D_(3′) in the routing direction. The metallic structure 250 and the diffusion area 220 can overlap with a distance D_(4′) in the routing direction. In some embodiments, the distance D_(3′) is larger than the distance D_(4′). In other embodiments, the distance D_(3′) is larger than the distance D_(2′). In still other embodiments, the distances D₁, D₂, D₃, and/or D₄ described above in conjunction with FIG. 1A can be larger than the distances D_(1′), D_(2′), D_(3′), and/or D_(4′), respectively.

In some embodiments, a sum of distances D_(1′)and D_(2′) can be substantially equal to the width W_(1′). In other embodiments, a sum of distances D_(3′) and D_(2′) can be larger or smaller than the width W_(1′). In still other embodiments, a sum of distances D_(3′) and D_(4′) can be substantially equal to the width W_(2′). In yet still other embodiments, a sum of distances D_(3′) and D_(4′) can be larger or smaller than the width W_(2′).

FIG. 2B is a cross-sectional view of an exemplary integrated circuit taken along a section line 2B-2B shown in FIG. 2A. In FIG. 2B, the metallic structures 270 a-270 d can directly contact the source region 211, the drain regions 213, 223, and the source region 221. The metallic structures 240, 250, and 260 can be electrically coupled with the source region 211, the drain regions 213, 223, and the source region 221 through the metallic structures 270 a-270 d. In some embodiments, the metallic structures 270 a-270 d can be disposed through the dielectric layer 251 and the ESL 253, directly contacting the silicide regions 211 b, 213 b, 221 b, and 223 b, respectively.

In some embodiments, the metallic structures 270 a-270 d can each include at least one barrier layer (not shown) at their bottom regions. The barrier layer may comprise at least one material such as aluminum oxide, aluminum, aluminum nitride, titanium, titanium nitride (TiN), tantalum, tantalum nitride, other suitable material, and/or combinations thereof. In some embodiments, the metallic structures 270 a-270 d each can be made of at least one material, such as aluminum, copper, Ti, TiN, TaN, Ta, TaC, TaSiN, W, WN, MoN, MoON, RuO₂, and/or other suitable materials. In other embodiments, the metallic structures 270 a-270 d can each be made of tungsten, and the metallic structures 240, 250, and 260 can each be made of copper.

In some embodiments, top surfaces of the metallic structures 270 a-270 d can be substantially level with top surfaces of conductive layers 235 a and 235 b. The term “substantially level with” here can mean that the top surfaces of the metallic structures 270 a-270 d can be higher than the top surfaces of the conductive layers 235 a and 235 b by a distance, e.g., the thickness of the ESL 253. In some embodiments, the term “substantially level with” here can mean that the top surfaces of the metallic structures 270 a-270 d can be lower than the top surface of the ESL 253 due to a dishing effect on the top surfaces of the metallic structures 270 a-270 d resulting from an etch-back process or a chemical-mechanical polish (CMP) process. In other embodiments, the term “substantially level with” here can mean that the top surfaces of the metallic structures 270 a-270 d can be lower than the top surfaces of the conductive layers 235 a and 235 b due to a dishing effect on the top surfaces of the metallic structures 270 a-270 d resulting from an etch-back process or a chemical-mechanical polish (CMP) process.

Referring to FIG. 2A-2B, it is found that the metallic structures 270 a-270 d can be deployed for electrical connections between the metallic structures 240, 250, and 260 and the respective source region 211, the drain regions 213, 223, and the source region 221. The metallic structures 270 a-270 d can substantially cover the respective diffusion areas 210 and 220 in the routing direction. The resistances from the metallic structures 270 a-270 d to the source and drain regions can be desirably reduced. In some embodiments, the overlap distances D₁-D₄ of the metallic structures 240, 250, and 260 that are deployed for electrical connections can be reduced. It is also found that the top surfaces of the metallic structures 270 a-270 d can be substantially level with the top surfaces of conductive layers 235 a and 235 b. Parasitic capacitances between the metallic structures 270 a and 270 b and between the metallic structures 270 c and 270 d are low.

FIG. 3 is a flowchart illustrating an exemplary method of forming an integrated circuit. FIGS. 4A-4E are schematic cross-sectional views illustrating another exemplary method of forming the integrated circuit 200 taken along a section line 2B-2B shown in FIG. 2A. In FIG. 3 , a method 300 of forming an integrated circuit can include forming a first diffusion area and a section diffusion area on a substrate (process 310).

In some embodiments, the process 310 can form the diffusion areas 210 and 220 on the substrate 203 as shown in FIGS. 2A and 4A. In some embodiments, the process 310 can include forming the isolation structure 215 separating the diffusion area 210 from the diffusion area 220. In some embodiments, the formation of the isolation structure 215 may include patterning the semiconductor substrate 203 by a photolithographic process, etching a trench in the substrate (for example, by using a dry etching, wet etching, and/or plasma etching process), and filling the trench (for example, by using a chemical vapor deposition process) with a dielectric material. In some embodiments, the isolation structure 215 may have a multi-layer structure such as a thermal oxide liner layer filled with silicon nitride or silicon oxide. In some embodiments, the process 310 can be referred to as a STI process or a LOCOS process.

Referring to FIG. 4A, the N-type well region 207 and/or the P-type well region 209, in some embodiments, can be optionally formed in diffusion areas 201 and 205, respectively. The N-type well region 207 and/or the P-type well region 209 can be formed, for example, by photolithographic processes and ion implantation processes. In some embodiments, a thermal process and/or a rapid thermal process (RTP) can be performed to active dopants in the N-type well region 207 and/or the P-type well region 209.

Referring to FIG. 3 , the method 300 can include forming a drain region and a source region for the first type transistor in the first diffusion area (process 320). In some embodiments forming the P-type transistor 201 as shown in FIG. 4A, the process 320 can form the source region 211 and the drain region 213. IN some embodiments, the source and drain regions 211 and 213 can each include a P-type heavily doped region that can be formed, for example, by a photolithographic process and an ion implantation process.

In other embodiments, the process 320 can include forming the structures 211 c and 213 c in the source region 211 and the drain region 213, respectively. The structures 211 c and 213 c can provide a stress to the channel of the P-type transistor 201. In some embodiments, the structures 211 c and 213 c can be formed by an epitaxial process, a reduced-pressure CVD (RPCVD) process, a molecular beam epitaxy (MBE) process, a chemical vapor deposition (CVD) process, a metal-organic chemical vapor deposition (MOCVD) process, an atomic layer deposition (ALD) process, a multi-layer epitaxial process, or any combinations thereof

In some embodiments, the process 320 can optionally include forming the P-type LDDs 211 a and 213 a below spacers 241 a. The P-type LDDs 211 a and 213 a can be formed, for example, by a tilt-angle ion implantation process. In some embodiments, silicide regions can be formed on the structures 211 c and 213 c before a process 340 forming gate electrode portions, wherein the process can be referred to as a silicide-first process. In other embodiments, the process 320 can include forming the silicide regions 211 b and 211 c described below in conjunction with FIG. 4C. In other some embodiments, a thermal process and/or a rapid thermal process (RTP) can be optionally performed to active dopants in the source region 211 and the drain region 213.

Referring again to FIG. 3 , the method 300 can include forming a drain region and a source region for the second type transistor in the second diffusion area (process 330). In some embodiments forming the N-type transistor 205 as shown in FIG. 4A, the process 330 can form the source region 221 and the drain region 223. In some embodiments, the source and drain regions 221 and 223 can each include an N-type heavily doped region that can be formed, for example, by a photolithographic process and an ion implantation process.

In other embodiments, the process 330 can include forming a stress structure (not shown) in each of the source and drain regions 211 and 213. The stress structures can provide a stress to the channel of the N-type transistor 205 that is opposite to the stress provided by the structures 211 c and 213 c. The stress structures can be formed by an epitaxial process, a reduced-pressure CVD (RPCVD) process, a molecular beam epitaxy (MBE) process, a chemical vapor deposition (CVD) process, a metal-organic chemical vapor deposition (MOCVD) process, an atomic layer deposition (ALD) process, a multi-layer epitaxial process, or any combinations thereof.

In some embodiments, the process 330 can optionally include forming the N-type LDDs 221 a and 223 a below spacers 241 b. The N-type LDDs 221 a and 223 a can be formed, for example, by a tilt-angle ion implantation process. In some embodiments, silicide regions can be formed on the source region 211 and the drain region 213 before the process 340 forming gate electrode portions, wherein the process can be referred to as a silicide-first process. In other embodiments, the process 330 can include forming the silicide regions 221 b and 221 c described below in conjunction with FIG. 4C. In other some embodiments, a thermal process and/or a rapid thermal process (RTP) can be optionally performed to active dopants in the source and drain regions 221 and 223. It is noted that the sequence of the processes 320 and 330 described above in conjunction with FIG. 3 can be switched. For example, the process 330 can be performed before the process 320. It is also noted that the process steps and/or their sequence in each of the processes 320 and 330 can be modified and/or switched. The scope of this application is not limited thereto.

Referring again to FIG. 3 , the method 300 can include forming a gate electrode continuously extending across the first diffusion area and the second diffusion area (process 340). In some embodiments, the method can include forming a gate electrode 230 as shown in FIG. 2A.

The gate electrode 230 can be formed by a gate-first process or a gate-last process. In some embodiments using a gate-last process, the process 340 can include forming dummy gate electrodes 232 a and 232 b over the substrate 203 as shown in FIG. 4A. The dummy gate electrodes 232 a and 232 b can be made of at least one material such as polysilicon, amorphous silicon, silicon oxide, silicon nitride, a material having an etching rate that is substantially different from the dielectric layer 251 and/or the spacers 241 a-241 b. In some embodiments, the dummy gate electrodes 232 a and 232 b can be formed by a CVD process.

The process 340 can include removing the dummy gate electrodes 232 a and 232 b, for example, by a wet etch process, a dry etch process, or any combinations thereof. After removing the dummy gate electrodes 232 a and 232 b, the process 340 can include forming gate electrode portions 230 a and 230 b over the substrate 203. The gate electrode portions 230 a and 230 b can include multi-layer structures 231, 233 and conductive layers 235 a, 235 b, respectively. The multi-layer structures 231 and 233 can be formed, for example, by any suitable process, such as an ALD process, CVD process, a physical vapor deposition (PVD) process, a reduced-pressure CVD (RPCVD) process, a PECVD process, an MOCVD process, or any combinations thereof. The conductive layers 235 a and 235 b can be formed, for example, by any suitable process, such as an ALD process, CVD process, a physical vapor deposition (PVD) process, a reduced-pressure CVD (RPCVD) process, a PECVD process, an MOCVD process, a plating process, a sputtering process, or any combinations thereof After the formation of the gate electrode portions 230 a and 230 b, an ESL layer 253 can be formed over the gate electrode portions 230 a and 230 b, for example, by a CVD process.

Referring again to FIG. 3 , the method 300 can include forming a first metallic structure, a second metallic structure, and a third metallic structure (process 350). The first metallic structure can be electrically coupled with the first source region, the second metallic structure can be electrically coupled with the first drain region and the second drain region, and the third metallic structure can be electrically coupled with the second source region.

In some embodiments forming the metallic structures in a manner that is similar to the sectional view shown in FIG. 1B, the dielectric layer 155 can be formed over the ESL layer 153. The metallic structures 140, 150, and 160 can be formed through the dielectric layers 151, 155 and the ESL layer 153, such that the metallic structures 140, 150, and 160 can directly contact the respective source and drain regions 111, 113, 121, and 123.

In some embodiments forming the metallic structures in a manner that is similar to the structures shown in FIGS. 2A-2B, the method 300 can further include forming metallic structures 270 a-270 d that are electrically coupled with the respective metallic structures 240, 250, and 260. In some embodiments, the method 300 can include forming openings 271 a-271 c through the dielectric layer 251 and the ESL 253. The openings 271 a-271 c can at least partially expose the respective source and drain regions 211, 213, 221, and 223 as shown in FIG. 4C.

In some embodiments, after forming the openings 271 a-271 c, silicide regions 211 b, 213 b, 221 b, and 223 b can be formed in the respective source and drain regions 211, 213, 221, and 223. As noted, the silicide regions 211 b, 213 b, 221 b, and 223 b shown in FIG. 4C are formed after the formation interfacial layers 217 a-217 b and the high-k dielectric layers of the multi-layer structures 231 and 233. The silicide regions 211 b, 213 b, 221 b, and 223 b are free from being subjected to thermal cycles of forming the interfacial layers 217 a-217 b and the high-k dielectric layers of the multi-layer structures 231 and 233. In some embodiments, the process of forming the silicide regions 211 b, 213 b, 221 b, and 223 b can be referred to as a silicide-last process.

Referring to FIG. 4D, the method 300 can include forming metallic structures 270 a-270 d directly contacting the respective source and drain regions 211, 213, 221, and 223. The metallic structures 270 a-270 d can be formed, for example, by depositing a PVD process, a CVD process, an ALD process, a sputtering process, a plating process, other suitable methods, or any combinations thereof

Referring to FIG. 4E, the process 350 (shown in FIG. 3 ) can include forming the metallic structures 240, 250, and 260 that are electrically coupled with the respective metallic structures 270 a-270 d. In some embodiments, the process 350 can include forming openings (not labeled) through the dielectric layer 255. The openings can at least partially expose the respective metallic structures 270 a-270 d. The metallic structures 240, 250, and 260 are then formed within the openings, electrically coupling with the respective metallic structures 270 a-270 d. In some embodiments, the metallic structures 240, 250, and 260 can be formed, for example, by depositing a PVD process, a CVD process, an ALD process, a sputtering process, a plating process, other suitable methods, and/or combinations thereof

FIG. 5 is a schematic drawing illustrating a system including an exemplary integrated circuit disposed over a substrate board. In FIG. 5 , a system 500 can include an integrated circuit 502 disposed over a substrate board 501. The substrate board 501 can include, in some embodiments, a printed circuit board (PCB), a printed wiring board and/or other carrier that is capable of carrying an integrated circuit. The integrated circuit 502 can be similar to the integrated circuit 100 or 200 described above in conjunction with FIGS. 1A-1B and 2A-2B, respectively. The integrated circuit 502 can be electrically coupled with the substrate board 501. In some embodiments, the integrated circuit 502 can be electrically coupled with the substrate board 501 through bumps 505. In other embodiments, the integrated circuit 502 can be electrically coupled with the substrate board 501 through wire bonding (not shown). The system 500, in some embodiments, can be part of an electronic system such as computers, wireless communication devices, computer-related peripherals, entertainment devices, or the like.

In some embodiments, the system 500 including the integrated circuit 502 can provide an entire system in one IC, so-called system-on-chip (SOC) or system-on-integrated-circuit (SOIC) devices. These SOC/SOIC devices may provide, for example, all of the circuitry needed to implement a cell phone, personal data assistant (PDA), digital VCR, digital camcorder, digital camera, MP3 player, or the like in a single integrated circuit.

FIG. 6A is a schematic drawing illustrating exemplary layout layers of an exemplary integrated circuit; FIG. 6B is a corresponding cross-sectional view. Items of FIG. 6A/B that are the same items in FIG. 2A are indicated by the same reference numerals, increased by 400. In FIG. 6 , an integrated circuit 600 includes diffusions areas 610 and 620 that are separated from each other and configured for different types of transistors 601 and 605, respectively. For example, the diffusion area 610 is configured for a P-type transistor and the diffusion area 620 is configured for an N-type transistor. The transistor 601 includes a source region 611 and a drain region 613 in the diffusion area 610. The transistor 605 includes a source region 621 and a drain region 623 in the diffusion area 620.

Referring to FIG. 6A, the integrated circuit 600 including a gate electrode 630 continuously extends across the diffusion areas 610 and 620 in a routing direction. In some embodiments, the integrated circuit 600 includes a plurality of metallic structure, e.g., metallic structures 670 a-670 d, each directly contacting one of the source regions 611, 621 and the drain regions 613, 623. The integrated circuit 600 can include metallic structures 640, 650 and 660 that are disposed over and electrically coupled with the metallic structures 670 a, 670 b, 670 d and 670 c, respectively. In some embodiment, the metallic structure 650 continuously extends from the metallic structure 670 b to the metallic structure 670 d.

In some embodiments, a width W_(M1) of the metallic structure 670 b is substantially equal to or larger than a width W_(M2) of the metallic structure 650. In other embodiments, a ratio of the width W_(M1) to width W_(M2) can range from about 1:1 to about 2:1. In still other embodiments, a ratio of the width W_(M1) to width W_(M2) can range from about 1.3:1 to about 1.6:1

In some embodiments, a width W_(M3) of the metallic structure 670 d is substantially equal to or larger than a width W_(M2) of the metallic structure 650. In other embodiments, a ratio of the width W_(M3) to width W_(M2) can range from about 1:1 to about 2:1. In still other embodiments, a ratio of the width W_(M3) to width W_(M2) can range from about 1.3:1 to about 1.6:1.

In some embodiments, a width W_(M4) of the metallic structure 670 a is substantially equal to or larger than a width W_(M5) of the metallic structure 650. In other embodiments, a ratio of the width W_(M2) to width W_(M5) can range from about 1:1 to about 2:1. In still other embodiments, a ratio of the width W_(M4) to width W_(M5) can range from about 1.3:1 to about 1.6:1.

In some embodiments, a width W_(M6) of the metallic structure 670 c is substantially equal to or larger than a width W_(M7) of the metallic structure 660. In other embodiments, a ratio of the width W_(M6) to width W_(M7) can range from about 1:1 to about 2:1. In still other embodiments, a ratio of the width W_(M6) to width W_(M7) can range from about 1.3:1 to about 1.6:1.

It is noted that at least one of the widths W_(M1), W_(M3), W_(M4) and W_(M6) is substantially equal to or larger than the widths W_(M2), W_(M5) and W_(M7), respectively. In some embodiments, only one of the metallic structures 670 a-670 d is wider and applied in the integrated circuit 600. In other embodiments, two or more of the metallic structures 670 a-670 d are wider and applied in the integrated circuit 600. In still other embodiments, all the metallic structures 670 a-670 d are wider than the respective metallic structures 640, 650 and 660.

As noted, adjusting the widths and/or lengths of the metallic structures 640, 650, 660 and/or 670 a-670 d can modify the contact resistances and/or parasitic capacitances of the integrated circuit 600. Changes of the contact resistances and/or parasitic capacitances may affect the operating speed of the integrated circuit 600. For example, the width of each of the metallic structures 640, 650 and 660 is fixed at a value about 20 nanometer (nm) for each of samples I-V. The widths of each of the metallic structures 670 a-670 d of the samples I-V are about 26 nm, 30 nm, 32 nm, 34 nm and 38 nm, respectively. Accordingly, the width ratio of the metallic structures 670 a-670 d and the respective metallic structures 640, 650 and 660 are 1.3:1, 1.5:1, 1.6:1, 1.7:1 and 1.9:1 for the samples I-V, respectively. It is noted that the sizes of the metallic structures 670 a-670 d described above are merely exemplary. In some embodiments, the sizes of the metallic structures 670 a-670 d can be scaled up or down depending on the applied technology node. The scope of this application is not limited thereto.

Table 2 illustrates simulation results including parasitic capacitances, contact resistances and operating speeds of the integrated circuits in response to the changes of the width ratios as described above.

TABLE 2 Sample I Sample II Sample III Sample IV Sample V Width ratio 1.3:1 1.5:1 1.6:1 1.7:1 1.9:1 Parasitic 1 1 1 1 1 capacitance Contact 1 0.98 0.97 0.96 0.95 resistance Operating 1 1.014 1.02 1.028 1.037 speed

Applicants found that the changes of the width ratio among the metallic structures 640, 650, 660 and/or 670 a-670 d can achieve unexpectedly improvement for operating speed of integrated circuits. As shown in Table 2, the integrated circuit of the sample I having the 1.3:1 width ratio is used as a base. It is found that the samples I-V have the same parasitic capacitance due the same width of the metallic structures 640, 650 and 660. It is also found that the contact resistance gradually declines due to the increase of the width of the metallic structures 670 a-670 d in the samples I-V. With the decrease of the contact resistance, the operating speed of the integrated circuit is increased in response to the increase of the width of the metallic structures 670 a-670 d.

It is noted that the integrated circuit 600 can be formed by a method that is as same as or substantially similar to the method 300 described above in conjunction with FIG. 3 and/or process stages described above in conjunction with FIGS. 4A-4E. The detailed description of the method is not repeated. It is also noted that the integrated circuit 600 can be applied in the system 500 described above in conjunction with FIG. 5 .

In an embodiment of this application, an integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is separated from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. A first metallic structure is electrically coupled with the first source region. A second metallic structure is electrically coupled with the second drain region. A third metallic structure is disposed over and electrically coupled with the first and second metallic structures. A width of the first metallic structure is substantially equal to or larger than a width of the third metallic structure.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

What is claimed is:
 1. A method of fabricating a semiconductor device, comprising: forming a first diffusion area and a second diffusion area in a substrate, wherein an isolation region extends from the first diffusion area to the second diffusion area; forming a first drain region and a first source region in the first diffusion area, wherein the first drain region and the first source region are doped with a first dopant type; forming a second drain region and a second source region in the second diffusion area, wherein the second drain region and the second source region are doped with a second dopant type; providing a gate electrode extending from over the first diffusion area and between the first drain region and the first source region to over the second diffusion area and between the second drain region and the second source region; depositing a dielectric layer adjacent the gate electrode and over the first diffusion area, the second diffusion area and the isolation region; etching an opening in the dielectric layer, wherein the opening contiguously extends from over the first drain region to over the second drain region, wherein the opening exposes a surface of the isolation region between the first drain region and the second drain region; depositing a first metallic structure over the first drain region in the opening and a second metallic structure over the second drain region in the opening, wherein a gap extends over the isolation region between the first metallic structure and the second metallic structure; and depositing a third metallic structure over the first metallic structure, over the second metallic structure, and extending to the surface of the isolation region in the gap.
 2. The method of claim 1, wherein the forming the second drain region includes epitaxially growing the second drain region such that the second drain region is higher than a top surface of the isolation region.
 3. The method of claim 1, further comprising: after the etching the opening in the dielectric layer, forming silicide regions on the first drain region and the second drain region.
 4. The method of claim 1, wherein the depositing the third metallic structure includes depositing copper.
 5. The method of claim 4, wherein the depositing the first metallic structure and the second metallic structure includes depositing tungsten.
 6. The method of claim 1, further comprising: depositing an etch stop layer over the gate electrode prior to etching the opening.
 7. The method of claim 6, wherein after etching the opening, a top surface of the etch stop layer over the gate electrode is exposed.
 8. The method of claim 1, wherein the depositing the third metallic structure includes forming an interface between the third metallic structure and a sidewall of each of the first metallic structure and the second metallic structure concurrently.
 9. A method of fabricating a semiconductor device, comprising: forming a first diffusion area and a second diffusion area in a substrate, wherein an isolation region extends from the first diffusion area to the second diffusion area; forming a first source/drain region in the first diffusion area and a second source/drain region in the second diffusion area; providing a gate electrode extending in a routing direction from over the first diffusion area to over the second diffusion area, wherein the first source/drain region and the second source/drain region are disposed on a first side of the gate electrode in a top view; etching an opening in a dielectric layer over the substrate, wherein the opening contiguously extends from over the first drain region to over the second drain region, wherein the opening exposes a surface of the isolation region between the first source/drain region and the second source/drain region; depositing a first metallic structure over the first drain region in the opening and a second metallic structure over the second drain region in the opening, wherein a gap extends over the isolation region between the first metallic structure and the second metallic structure; and depositing another dielectric layer over the gate electrode after depositing the first metallic structure and the second metallic structure; after depositing the another dielectric layer, forming another opening in the another dielectric layer, wherein the another opening extends from over the first metallic structure to over the second metallic structure and exposes a sidewall of the first metallic structure and a sidewall of the second metallic structure; and depositing a third metallic structure in the another opening, wherein the third metallic structure has a length greater than a width, the length extending in the routing direction.
 10. The method of claim 9, wherein the another opening in the another dielectric layer extends to a surface of the isolation region.
 11. The method of claim 10, wherein the surface of the isolation region extends between the first metallic structure and the second metallic structure.
 12. The method of claim 10, wherein depositing the third metallic structure includes depositing a first composition on the surface of the isolation region.
 13. The method of claim 12, wherein the first composition is copper.
 14. The method of claim 13, wherein the depositing the first metallic structure and the second metallic structure includes depositing a second composition different than the first composition.
 15. The method of claim 9, wherein the forming another opening exposes a top surface of the first metallic structure and a top surface of the second metallic structure, wherein the sidewall of the first metallic structure extends from the top surface of the first metallic structure and the sidewall of the second metallic structure extends from the top surface of the second metallic structure.
 16. A method of fabricating a semiconductor device, comprising: forming a first diffusion area and a second diffusion area in a substrate, wherein an isolation region extends from the first diffusion area to the second diffusion area; forming a first source/drain region in the first diffusion area and a second source/drain region in the second diffusion area; forming a first dielectric layer over the first source/drain region and the second source/drain region and an etch stop layer over the first dielectric layer; providing an opening in the first dielectric layer and the etch stop layer, wherein the opening extends to the isolation region; depositing a first metallic structure over the first source/drain region in the opening and a second metallic structure over the second source/drain region in the opening, wherein after the depositing the first metallic structure and the second metallic structure a gap between the first metallic structure and the second metallic structure; and depositing a third metallic structure in the gap.
 17. The method of claim 16, wherein the forming the etch stop layer includes forming an upper surface of the etch stop layer coplanar with an upper surface of the first metallic structure.
 18. The method of claim 16, wherein depositing the first metallic structure deposits a conductive material directly on a sidewall of the etch stop layer and a sidewall of the first dielectric layer.
 19. The method of claim 16, wherein the depositing the third metallic structure includes depositing a conductive material directly on the isolation region.
 20. The method of claim 19, wherein the depositing the third metallic structure further includes depositing the conductive material directly on a sidewall of the first metallic structure and a sidewall of the second metallic structure. 